August 24, 2020
Japan Display Inc.
Japan Display Inc. (JDI) (President, Representative Director, and CEO Minoru Kikuoka) has begun mass production of two types of glass-based capacitive fingerprint sensors certified by the Federal Bureau of Investigation (FBI).
Fingerprint sensor built onto LTPS glass substrate
Glass-based Capacitive fingerprint sensor module
(left side: new product (1); right side: new product (2))
Large-sized fingerprint sensors that have larger sensing area than conventional devices have started to become widely used in China, India, North America and Europe to enable more reliable personal identification at government agencies, financial institutions and educational institutions and are forecast to expand in the future. JDI products that use a glass substrate for capacitive fingerprint sensors used in compact and thin devices can achieve a large sensing area with fewer cost than silicon products with enhancing security.
JDI started mass production of capacitance type glass fingerprint sensor modules for smart door locks in December of 2018, JDI also has been collaborating with Image Match Design Inc. (iMD), a Taiwanese fingerprint sensor manufacturer, to develop two products that have received PIV※1 certification from the FBI in the US, and JDI has begun mass production in its Higashiura Plant.
About 1,000 fingerprint sensors manufactured by over 160 companies worldwide have been certified by the FBI in the US. By receiving this certification, it can be guaranteed that the fingerprint image obtained with the sensor is high quality and is compatible with NGI※2 authentication and specialist vendors that handle fingerprint authentication in a variety of situations.
JDI provides the sensor glass substrate for these products and iMD produces and sells the module.
JDI also plans to sell the module to the West North America and Europe through its group sales network.
【 Overview of Product Specifications 】
Existing product | New product (1) | New product (2) | |
FBI PIV certification | Not certified | PIV certified (applicable of FAP10※3) |
PIV certified (applicable of FAP30※4) |
Sensor type | Capacitive | Capacitive | Capacitive |
Effective sensor size | 10.4 × 13.9 mm (0.7 inches) | 12.8 × 18.0 mm (0.9 inches) | 20.3 × 25.4 mm (1.3 inches) |
Gradation | 256 | 256 | 256 |
Resolution | 192 × 256 | 256 × 360 | 400 × 500 |
Pixel density | 466 dpi※5 | 508 dpi | 500 dpi |
Start of mass production | Dec-18 | Jul-20 | Mar-20 |
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The information contained in this press release is accurate as of the date of issuance and is subject to change without notice. Information in this press release, other than statements of historical fact, constitutes forward-looking statements, which are based on available information, operating plans and projections about future events and trends. Forward-looking statements inherently involve risks and uncertainties that could cause actual results to differ materially from those predicted in such forward-looking statements.